ENTEGRIS英特格，FOUPS，Spectra™ FOUPs
Front opening unified pod platform with superior microenvironment control that provides clean and secure 300 mm wafer transport.
Industry-proven door provides equipment interoperability and long life
Integral wafer supports give excellent wafer plane performance and reliable wafer access
ESD shell option provides added wafer protection
Advanced purge options are available including front/rear purge and a purge diffuser that provides maximum gas dispersion
Optimized hydrophobic materials provide wafer contact and microenvironment control
APPLICATIONS
Spectra
FOUPs Applications
FOUP platform that provides clean and secure 300 mm transport and handling
Automation compatibility provides low cost of ownerhip
SPECIFICATIONS
Product Specifications
Dimensions Width 416 mm (16.4")
Depth 333 mm (13.1")
Height 335 mm (13.2")
Weight Empty 4.2 kg (9.26 lb)
With wafers 7.3 kg (16.09 lb)
Wafer spacing 10 mm (0.39")
Capacity 26 wafers
MATERIALS OF CONSTRUCTION
Ultrapure polycarbonate or barrier material used in the FOUP shell, door housing, and door panels
Carbon-filled PEEK or high-temperature barrier material (XT EBM) used in wafer contact areas in the shell, door housing, and door components
Thermoplastic elastomer material used in the critical door seal
Entegris moisture barrier material (EBM) available to enable leading-edge wafer processing technology
CONFIGURATION OPTIONS AND ACCESSORIES
Shell and Door Color Options
Amber, red, green, clear, and black (ESD shell only)
Purge Options
Front/rear standard purge
Rear advanced diffuser
Segregation Options
Info pads configurable by customer
Identification Options
Bar code and alphanumeric character labels
Color handle inserts
Cardholders
RFID tags with read/write capability
